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Kem hàn Alpha OM385SM

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Kem hàn Alpha OM385SM

Description

ALPHA OM-385SM is designed for blend with Type 5 (15 – 25µm) powder to meet market segments requiring ultra-fine features application involving an air reflow environment. ALPHA OM-385SM is capable of providing excellent printing performance down to 180µm pad size dimension with a 60o angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters.
ALPHA OM-385SM is able to yield excellent coalescence performance for 180µm circle deposits using an air reflow high soak preheat as hot as of 170 – 180°C for 120s, >230°C for 62s, 247°C peak temperature. More importantly, it also has the ability to exhibit excellent Head-In-Pillow resistance performance. Best performance is achievable though with a low soak profile as illustrated in Fig 1.

Product Details

Features and Benefits:

• Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out
• High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: Reflowable in high soak air & N2 reflow environment
• Excellent Head-in-Pillow Resistance: minimizes rework and increases first time yield
• Good Non Wet Open Resistance: minimizes rework and increase first time yield
• Excellent Coalescence and Wetting Performance: coalesces well for 180µm small circle deposit at high soak air environment
 
• Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out
• High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: Reflowable in high soak air & N2 reflow environment
• Excellent Head-in-Pillow Resistance: minimizes rework and increases first time yield
• Good Non Wet Open Resistance: minimizes rework and increase first time yield
• Excellent Coalescence and Wetting Performance: coalesces well for 180µm small circle deposit at high soak air environment
 

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